The global radiation-hardened electronics market size reached USD 1.45 Billion in 2021 and is expected to register a revenue CAGR of 3.5% during the forecast period, according to latest analysis by Emergen Research. Increasing demand for satellite communications in television broadcast, mobile phone connectivity, space-based monitoring, and surveillance are driving radiation-hardened electronics market revenue growth.
Increasing use of radiation-hardened electronics in several high-altitude applications is driving market revenue growth. This type of electronics are made of components such as silicon, silicon carbide, and gallium nitride, which are resistant to gamma and neutron radiation and high-energy radiation. These factors drive its adoption in applications such as aircraft, nuclear power plants, and satellites in the form of power supply devices, microprocessors, and switching regulators.
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The Radiation Hardened Electronics research report also includes an insightful study of the prominent players of the industry along with their business overview, strategic planning, and business expansion plans adopted by them. This assists the readers and business owners in formulating strategic expansion and investment plans.
The report focuses on mergers and acquisitions, joint ventures, collaborations, partnerships, corporate and government deals, and others. The report also talks about the expansions these prominent players are vying for in the key regions of the market. The report focuses on a detailed analysis of the technological and product developments undertaken by these companies.
Some major companies in the market include BAE Systems, Honeywell International Inc., Renesas Electronics Corporation, STMicroelectronics, Infineon Technologies AG, Microchip Technology Inc., IBM, Data Device Corporation, Cobham Limited, and Micropac Industries, Inc.
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Emergen Research has segmented global Radiation Hardened Electronics market on the basis of product type, material type, manufacturing technique, component type, application, and region:
Product Type Outlook (Revenue, USD Million; 2019–2030)
Custom Made
Commercial-Off-The-Shelf (COTS)
Material Type Outlook (Revenue, USD Million; 2019–2030)
Silicon
Silicon Carbide
Gallium Nitride
Others
Manufacturing Technique Outlook (Revenue, USD Million; 2019–2030)
Radiation-Hardening-By-Design (RHBD)
Radiation-Hardening-By-Process (RHBP)
Radiation-Hardening-By-Software (RHBS)
Component Type Outlook (Revenue, USD Million; 2019–2030)
Memory
Logic
Power Management
Field-Programmable Gate Array
Application Specific Integrated Circuit
Analog & Digital Mix Signals
Controllers & Processors
Application Outlook (Revenue, USD Million; 2019–2030)
Space Satellites
Aerospace & Defense
Nuclear Power Plants
Commercial Satellites
Medical
Others
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On the basis of regional analysis, the market is segmented into the following regions: North America, Latin America, Europe, Asia Pacific, and Middle East & Africa. The market is expected to be dominated by North American nations closely followed by European countries. Asia Pacific is expected to show a significant growth owing to recent advancements and rising investments in the R&D sector.
Key Questions Answered in the Report:
What will be the estimated growth rate of the Radiation Hardened Electronics market by 2030?
Who are the prominent distributors, vendors, and manufacturers of the market?
What are the driving and restraining factors of the growth of the Radiation Hardened Electronics market throughout the forecast period?
What are the current and future market trends of the Radiation Hardened Electronics market?
What are the sales and price analysis of the product by types, applications, and regions?
What are the expected opportunities for the companies and new entrants in the coming years?
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