The global 3D integrated circuit (IC) market size was USD 10.76 Billion in 2021 and is expected to register a revenue CAGR of 21.6% over the forecast period, according to the latest report by Reports and Data.
The market is experiencing revenue growth as a result of an increase in demand for smart devices like smartphones and tablets. For smartphones, 3D IC enables more complex integrations, including multi-axis accelerometers, microphones, and gyroscopes. In the year 2023, it is predicted that there will be 1.48 billion smartphones shipped worldwide. Also, the gaming industry's expansion is driving up product demand. With more than 2.5 billion gamers worldwide, the video game business is expanding quickly. The major market players are always developing and releasing the newest products, which further fuels the 3D Integrated Circuit (IC) industry's rapid increase in demand and notable revenue growth.
For instance, in November 2022, the robust, gorgeous new MINI-DATA-BOX was introduced by German electronics manufacturer OKW, which also increased its array of sensor enclosures. Due to the several versions, sizes, colours, and optional flanges—all of which are standard, there are 32 possible combinations. The inventive, compact MINI-DATA-BOX is ideal for IoT/IIoT, automation, security and surveillance, environment monitoring and control, smart logistics, peripherals, interfaces, and ICT applications. It also functions well with wearable technology thanks to its small size.
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The global 3D integrated circuit market is experiencing significant revenue growth due to various factors. The rising demand for smart devices like smartphones and tablets, coupled with the growth of the gaming industry, is driving the market's expansion. The ability of 3D IC to enable more advanced integrations in smartphones, such as multi-axis accelerometers, microphones, and gyroscopes, is a significant factor in this growth.
The global smartphone shipments are expected to reach 1.48 billion units in 2023, further boosting the demand for 3D ICs. Additionally, the video game industry is rapidly growing, with more than 2.5 billion gamers worldwide, which is creating more demand for advanced technology.
Some Key Highlights from the Report
- The global 3D Integrated Circuit (IC) market is divided into real 3D ICs and 3D stacked ICs based on type. In 2022, the segment with the highest revenue share was 3D stacked ICs. It is common practise to manufacture several layers, stack them, and then thin them to create these multi-layer chips. Stacking can be done using wafer-on-wafer, die-on-wafer, die-on-die, or a combination of these techniques. When many dies are piled on top of one another rather than side by side, a smaller chip is created. The compact size of 3D-ICs is highly valued by smartphones and Internet of Things applications, among other miniaturised devices.
- Over the projected period, the market in Asia Pacific is anticipated to develop at the fastest rate, according to geographical analysis, and it will have contributed the greatest revenue share in 2022. The consumer electronics market in this region is expanding in terms of revenue thanks to factors including the expanding telecom sector and increased demand for consumer electronics products. The region's dense population is a key factor in the rise in smart device sales. The market revenue growth in this area is also being fueled by the presence of top industry players like Samsung Electronics Co., Toshiba, and Sony Corporation, among others. Leading market companies are forming alliances and creating cutting-edge technologies, which will further lead to a considerable increase in market income in this area.
- The Integrity 3D-IC platform was launched by Cadence Design Systems, Inc. on October 6th, 2021. The system analysis, design planning, and high-capacity 3D implementation are all combined into a single, unified cockpit, making it the first 3D-IC platform on the market. The third-generation 3D-IC solution from Cadence is based on the Integrity 3D-IC platform, which offers customers integrated thermal, power, and static timing analysis capabilities along with system-driven power, performance, and area (PPA) for specific chipsets.
Top Companies Operating in the Global 3D Integrated Circuit (IC) Market:
Samsung, Toshiba Corporation, ASE Group, STMicroelectronics, Taiwan Semiconductor Manufacturing Company Limited, Intel Corporation, Broadcom, Amkor Technology, United Microelectronics Corporation, Enovix Corporation, Cadence Design Systems, Inc., Advance Micro Devices, Inc.
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The market players are also contributing to the growth of the market by launching innovative products. For instance, in November 2022, OKW, a German-based electronics manufacturing company, introduced its new MINI-DATA-BOX, which is perfect for IoT/IIoT, automation, security and surveillance, monitoring, and control of the environment, smart logistics, peripherals, interfaces, and ICT applications. This product's small and compact size also makes it ideal for wearable devices.
The global market is further segmented into type and application:
Type Outlook (Revenue, USD Billion; 2019-2030)
- 3D Stacked ICs
- True 3D ICs
Packaging Technology Outlook (Revenue, USD Billion; 2019-2030)
- 3D wafer-level chip-scale packaging
- 3D TSV
End-Use Outlook (Revenue, USD Billion; 2019-2030)
- IT & Telecommunication
- Consumer Electronics
- Military & Defense
Application Outlook (Revenue, USD Billion; 2019-2030)
Regional analysis provides insights into key trends and demands in each major country that can affect market growth in the region.
- North America (U.S., Canada, Mexico)
- Europe (Germany, U.K., Italy, France, BENELUX, Rest of Europe)
- Asia Pacific (China, India, Japan, South Korea, Rest of APAC)
- Latin America (Brazil, Rest of LATAM)
- Middle East & Africa (Saudi Arabia, U.A.E., South Africa, Rest of MEA)
Key Takeaways of the Competitive Overview Section:
- Overview of the company profiles of each market player
- Industrial chain analysis of each player
- Revenue share contribution
- Sales network and distribution channels and net profits and losses of each company
- Key business growth strategies are undertaken by these players
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Overall, the 3D integrated circuit market is experiencing significant revenue growth due to the increasing demand for smart devices and the growth of the gaming industry. The ability of 3D ICs to enable advanced integrations is also contributing to this growth. The launch of innovative products by market players is further fueling this growth.
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