When the power source is turned on, a direct current (DC) flows through the circuit, causing the metal ions in the electrolyte to move towards the cathode. As the metal ions come into contact with the cathode, they gain electrons and are reduced to form a solid metal coating on the surface of the cathode. At the same time, the metal anode is slowly dissolved into the electrolyte, replenishing the metal ions that are being plated onto the cathode.

The rate of Electroplating is controlled by several factors, including the current density, the temperature of the electrolyte, and the composition of the electrolyte. Higher current densities will result in faster plating rates, but they may also lead to uneven coatings or other defects. Similarly, higher temperatures may speed up the plating process but can also lead to decreased quality if not carefully controlled.

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