Use of Smt Stencil Clean Roll
SMT Stencil Clean Roll wipe characteristics and solvents
The wiping cloth under the template must be very suitable for solvent compatibility, but it must also be low-lint. Large and small fibers deposited into the solder from the wiping stencil roll may hinder, bridge, or produce uneven solder deposits. Cleaning and excess removal are important to the SMT template cleaning process, because any residual material will affect the chemical and adhesive properties.
In higher-pitch components, wiping the bottom of the template works well. On larger features, a small amount of solder paste on the hole wall will not have a substantial impact on the printing process.
The consistency of the stencil wipe material is important for dry wipe and wet wipe. When wiping wet, it is important that the stencil wiping material absorb moisture quickly and evenly. Pre-saturated template wipes can achieve more tactile cleaning while reducing VOC emissions and wetting variability. VOC emissions are not only irritating and toxic to workers, but also suffocation and fire hazards.
For more product-related information, please click:Lint-free Wipes
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