Photosensitive Polyimide Coatings Market Expected to Reach USD 1.18 Billion by 2031, Fueled by Growth in Chip Packaging and Foldable Displays
[Hyderabad 17th, June 2025] — Clearview Market Insights reports that the global photosensitive polyimide coatings market is projected to grow from USD 610 million in 2024 to USD 1,180 million by 2031, at a CAGR of 9.8%. The demand for high-performance materials in chip packaging, flexible electronics, and advanced sensor systems is driving this expansion.
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Photosensitive polyimides (PSPI) combine photoresists' processing advantages with traditional polyimides' durability, enabling high-resolution patterning for wafer-level packaging, redistribution layers, and flexible displays. Their excellent thermal, chemical, and mechanical resistance makes them ideal for 5G, AI, and automotive electronics.
The evolution of advanced packaging—from flip-chip to FOWLP—has placed PSPI at the center of next-gen IC development," said a CVMI analyst. "These materials also unlock new designs in flexible and foldable devices, helping manufacturers scale functionality without compromising durability.
Leading players like Toray, Fujifilm, DuPont, and Hitachi Chemical are innovating in ultra-thin, dual-function, and bendable PSPI systems. Their applications now extend beyond semiconductors to displays, wearable electronics, sensors, and printed flexible circuits.
Asia-Pacific leads the market with robust supply chain integration in South Korea, China, Taiwan, and Japan. North America and Europe are fostering innovation in heterogeneous integration and MEMS packaging.
As integration density increases and thermal budgets tighten, photosensitive polyimides will remain essential to the high-end electronics roadmap. Environmental performance, resolution scalability, and co-optimization with resist systems will determine future success.
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