According to the current analysis of Reports and Data, the global Phase-Change Thermal Interconnection components market was valued at USD 1.31 Billion in 2019 and is projected to reach USD 6.13 Billion value by the year 2027, at a CAGR of 21.4%. %. Phase Change Thermal Interconnection Material (PCM) is the technology used for producing bulk thermal conductivity, melting enthalpy, specific heat capacity, and contact resistance. Phase Change Thermal Interconnection Material is basically used for the preprocessor of electronic devices such as computers, smartphones, CPUs, etc. More recently, the development of the Phase Change Materials (PCM) of the high-powered Pentium processor class of interconnection materials gained worldwide acceptance. The large quantities of heat created by these processors demanded a carefully designed thermal route where all of the thermal resistances were reduced. For the case-to-heatsink interconnection, this mandated that thermal grease be used to minimalize the interconnection resistance. Fortunately, PCM’s provided an alternate to the messy application and further the migration problems associated with thermal grease. PCM can be bifurcated in the Conductive type (Electrically Conductive and Non-electrically Conductive).

Thermal Interconnection Material has key properties such as Low thermal Impedance, High bulk conductivity, and high surface wetting and low thermal contact resistance suited for the mass-production activity. Achieving contact at the interconnection and full surface wetting is critical for maximizing heat transfer and minimizing contact resistance. The flexibility to infiltrate varying degrees of surface roughness is critical. Lower viscosity is linked with higher wetting properties and can be measured by the contact angle. A lower contact angle points towards excellent wetting. While the actual throughput rates are dependent on the equipment capacities, it is not uncommon to be able to produce small parts at a rate of several thousand per hour. In 2019, Asia-Pacific was the chief consumer of PCM components, followed by North America. The inorganic PCM accounts for the largest share among types of PCM owing to the increasing usage in numerous applications due to its high latent heat of fusion, good thermal conductivity, non-flammability, and lower cost. 

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The demand for energy-efficient solutions in the electronics sector is indeed driving the increasing usage of PCTIM (Polymer Composite Thermal Interconnection Materials). PCTIM materials possess high thermal conductivity and low thermal resistance properties, which help reduce energy consumption in electrical devices. As the industry moves towards sustainability and energy efficiency, there is a growing need for PCTIM materials to support these goals, thus contributing to market revenue growth.

The emphasis on developing environmentally friendly and sustainable thermal management solutions is a significant priority for manufacturers, and this is fueling the substantial growth of the PCTIM market. By minimizing the use of hazardous chemicals and reducing carbon emissions, PCTIM materials align with environmental sustainability efforts.

However, the high price of PCTIM materials may hinder market revenue growth. The availability of alternative thermal management products, such as thermal greases and pads, can also affect the growth of the PCTIM market as they provide cheaper options for thermal management.

Despite these challenges, the PCTIM market is expanding significantly due to the increasing demand for electronic devices with high-performance requirements and effective thermal management solutions. Factors such as the need for energy efficiency, the trend towards miniaturization in electrical equipment, and the widespread adoption of PCTIM across various industries are driving this growth. Manufacturers will need to address the cost factor and continue to innovate to maintain and expand their market share in the face of competition from alternative thermal management options.

Top Companies Operating in the Global Phase Change Thermal Interconnection Materials Market:

Croda International PLC, Parker Hannifin Corp., Boyd Corporation, Honeywell International Inc., Wakefield Vette, Laird Technologies, Phase Change Energy Solution Inc., Nusil Technologies, Arctic Silver, Enerdyne Thermal Solution.

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The global market is further segmented into type and application:

Conductive Type (Revenue, USD Million; Volume in Tons, 2017–2027)

• Electrically Conductive
• Non-Electrically Conductive

Conductive Type (Revenue, USD Million; Volume in Tons, 2017–2027)

• Paraffin
• Non-paraffin
• Eutectic Salts
• Salt Hydrates

Conductive Type (Revenue, USD Million; Volume in Tons, 2017–2027)

• Aluminum Oxide
• Boron Nitride
• Aluminum Nitride
• Zinc Oxide

Application (Revenue, USD Million; Volume in Tons, 2017–2027)

• Telecom
• Automotive
• Electrical & Electronics
• Computers
• Others

Regional analysis provides insights into key trends and demands in each major country that can affect market growth in the region.

• North America (U.S., Canada, Mexico)
• Europe (Germany, U.K., Italy, France, BENELUX, Rest of Europe)
• Asia Pacific (China, India, Japan, South Korea, Rest of APAC)
• Latin America (Brazil, Rest of LATAM)
• Middle East & Africa (Saudi Arabia, U.A.E., South Africa, Rest of MEA)

Further key findings from the report suggest

·       As of 2019, electrically conductive is the leading type segment of the global phase change thermal interconnection materials This segment is projected to register the fastest growth with the highest CAGR of 21.6% during the forecast period due to its rising preference in end-use applications

·       The paraffin Binder type in phase-change thermal interconnection materials segment has shown a significant growth trend in 2019 and is expected to maintain the position during the forecast period

·       The aluminum oxide filler type of phase change thermal interconnection materials accounted for the most significant market share in 2019 and a significant growth rate of 21.9% during 2019-2027. It is projected to maintain its lead with a significant CAGR during the forecast period

·       The computer end-use segment is the fastest-growing segment, registering the highest CAGR followed by the electrical & electronics segment which held the second position in the phase change thermal interconnection materials market

·       The Asia-Pacific region accounted for the most significant market share in 2019. This region is proposed to remain the dominant regional segment with a CAGR of 23.4% during 2020-2027. The China country is the fastest-growing economy, which is projected to drive the global Phase change thermal interconnection materials market.

·       Both North America and Europe regions are forecasted to show significant growth over the coming years

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