The global low dielectric materials market size is projected to grow from USD 1.7 billion in 2022 to reach USD 2.4 billion by 2027, at a CAGR of 6.7%. The major factors driving the nanocellulose market include growth in air traffic across the globe and increasing funding for development of 5G network from government & private sectors of developed as well as developing nations.
Browse 247 market data Tables and 54 Figures spread through 241 Pages and in-depth TOC on "Low Dielectric Materials Market by Type, Material Type (Fluoropolymers, Modified Polyphenylene Ether, Polyimide, Cyclic Olefin Copolymer, Cyanate Ester, Liquid Crystal Polymer), Application, and Region - Global Forecast to 2027"
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Factors such as increasing usage of data & telecommunication products and the emergence of technologies such as IoT and machine learning are inflating the demand for low dielectric materials to reduce the loss in data transmission. This market is categorized based on type, material type, application, and region. Key factors that drive the market include increasing demand for low transmission-loss material having excellent product specifications and the growth in the private and government funding for the development of 5G in both developed and developing economies. According to MarketsandMarkets, the market size is projected to grow from USD 1.7 Billion in 2022 to reach USD 2.4 Billion by 2027, at a CAGR of 6.7%.
The low dielectric materials market is capital intensive, and the leading players include Solvay (Belgium), Showa Denko Materials Co. Ltd. (Japan), Chemours Company LLC (U.S.), Arxada (Switzerland), Asahi Kasei (Japan), and Shin-Etsu Chemical Co., Ltd. (Japan). Other major players in the market include Huntsman Corporation (U.S.), SABIC (Saudi Arabia), DIC Corporation (Japan), Arkema (France), Mitsubishi Corporation (Japan), Dow (U.S.), Olin Corporation (U.S.), and Celanese Corporation (U.S.). Companies such as Nishimura Advanced Ceramics (Japan) and CeramTec (Germany) also operate in market with provision of low dielectric ceramics. These players have adopted various growth strategies to further expand their presence in the market. New product launch, expansion, acquisition, agreement, and supply partnerships have been the leading strategies adopted by the major players in the last five years to strengthen their competitiveness and broaden their customer base in the global low dielectric materials market.
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Solvay (Belgium) is gaining momentum in the market by expanding product portfolio and supply agreement strategies. The company has a diversified portfolio of low dielectric materials including fluoropolymers under the brand Hyflon PFA & MFA, Polymist PTFE and Algofon PTFE. The company also markets PVDF under brand Solef, Xydar LCP, Ryton PPS and Cycom Cyanate Ester. These products are specially developed for OEMs of electronic components to reduce challenges in transmitting high-frequency signals with minimum signal loss. In April 2021, Solvay introduced Amodel Supreme PPA, a line of high-performance polyphthalamide featuring improved electrical properties such as volume resistivity and excellent dielectric strength above 150C. It also introduced KetaSpire PEEK XT, the industry’s first high temperature PEEK with 50% more dielectric strength than standard PEEK.
Showa Denko is one of the largest manufacturers of PTFE and SF resins across the globe. The company rebranded itself from Hitachi Chemicals to Showa Denko in October 2020, and is focused on improving its share in the market via product development and capacity expansion strategies. For example, the company announced to increase the production capacity at its subsidiary, Showa Denko Semiconductor Materials (Taiwan) Co., Ltd. for polishing materials for flattening semiconductor circuits (CMP slurry), laminate materials for printed wiring boards (prepreg), and photosensitive solder resists. The expansion was made to cater to the increasing demand for data centers and mobile terminals due to the commercial application of fifth-generation mobile communications systems (5G).
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