Hybrid Memory Cube (HMC) is a revolutionary innovation in DRAM memory architecture that has set a new standard for memory performance, power consumption, and cost. Hybrid Memory Cube (HMC) is a high-performance RAM delivering unprecedented system performance and bandwidth which interface through-silicon vias (TSV)-based stacked DRAM memory competing with the incompatible rival interface High Bandwidth Memory (HBM).
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Market Dynamics
Saving and retrieving digital information is one of the major challenges of large organizations. This challenge can be solved by utilizing Hybrid Memory Cube (HMC) owing to its advantages such as increased bandwidth, reliability, power reduction, and simple design. Thus, the growing demand for saving and retrieving digital information needs will propel the HMC market in the forecast period.Further, the growing need for high-performance computing catering to specific demands is expected to increase the demand for HMC, as it can enable drastic bandwidth and performance improvements. Also, the architecture of the hybrid memory cube is more efficient than the current memory; it utilizes 70% less energy per bit compared to current DRAM technologies. Thus, growing demand from applications of hybrid memory cubes such as data centers, smartphones, and high-end computation devices are further driving the hybrid memory cube market.
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Segment Analysis
Based on product type the global hybrid memory cube market is broadly segmented as field-programmable gate array, central processing unit, graphics processing unit, application-specific integrated circuit, accelerated processing unit. A hybrid memory cube is developed for this specific application to support advanced and intensive real-time processing. A central processing unit plays a vital role in handling a lot of the applications and content and processing that content. Therefore, advanced CPUs wide adopt the HMC technology to extend the performance of CPUs for servers instead of increasing the number of CPUs, further improving the overall energy efficiency of CPUs by eliminating connections between chips.
Competitive Landscape
Significant players in the global hybrid memory cube market are Micron Technologies Inc., Intel Corporation, Xilinx Inc., Sk Hynix, ARM, Open Silicon Inc., IBM, TekStart LLC, and others. The majority of these prominent players are adopting a few organic and inorganic strategies such as product launches, collaboration, product agreements, and other key developments to enhance their product portfolio in the global hybrid memory cube market. For instance, in September 2016, Micron Technology launched the third-generation hybrid memory cube technology. The third-generation HMC doubles the data rate of the memory.
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