The Global Bonding Sheet Market involves the use of adhesive or bonding sheets for bonding metallic and non-metallic components in electronics devices. Bonding sheets are thin and flexible sheets made using thermoplastic or thermoset adhesives. They help bond components during the production process of electronic devices offering advantages like ease of use, uniform bonding, and heat resistance. Bonding sheets find wide application in bonding integrated circuits, LEDs, and other components in smartphones, tablets, wearables, and other consumer electronics. They help miniaturize electronic devices by providing uniform thin bonding between layers and components. The ability of bonding sheets to offer thin and uniform bonding has assisted in significant miniaturization of several electronic devices over the past decade.

The Global Bonding Sheet Market is estimated to be valued at US$ 446.07 Mn in 2024 and is expected to exhibit a CAGR of 7.5% over the forecast period 2024 To 2031.

Key players operating in the Global Bonding Sheet Market are Arisawa Manufacturing Co., Dexerials Corporation, DuPont, Fujikura Ltd., Hanwha Solutions Advanced Materials Division, Microcosm Technology Co., Ltd., Namics Corporation, Nikkan Industries Co.,Ltd, Nippon Mektron Ltd., Nitto Denko Corporation, Shin-Etsu Polymer Co., Ltd., Showa Denko Materials Co., Taiflex Scientific Co. Ltd., Toray Industries, Inc., Qinglong Adhesives, Orion Packart.

Key Takeaways

Key players operating in the Global Bonding Sheet Market are Arisawa Manufacturing Co., Dexerials Corporation, DuPont, Fujikura Ltd., Hanwha Solutions Advanced Materials Division, Microcosm Technology Co., Ltd., Namics Corporation, Nikkan Industries Co.,Ltd, Nippon Mektron Ltd., Nitto Denko Corporation, Shin-Etsu Polymer Co., Ltd., Showa Denko Materials Co., Taiflex Scientific Co. Ltd., Toray Industries, Inc., Qinglong Adhesives, Orion Packart. There is growing demand for bonding sheets from electronics manufacturers to assist miniaturization through thin uniform bonding between components. The market players are expanding their business globally with a focus on Asia Pacific to leverage the growth in electronics production in countries like China, South Korea, Japan and Taiwan.

Market Drivers

The key driver for the Global Bonding Sheet Market is the rising demand for miniaturization of electronic devices from consumers. Miniaturization allows electronics manufacturers to develop smartphones, wearables, and other consumer devices with enhanced features and functionalities in compact form factors. Bonding sheets play a critical role in enabling miniaturization as they provide thin and uniform bonding between layers and components. This allows integrating more circuitry and components in lesser space within electronic devices. The demand for high-performance smartphones, tablets and other smart devices will continue driving demand for bonding sheets that assist miniaturization and support device functionalities.