CMP Slurry : From Abrasive Particles To Nanoscale Polishing Agents
Solvents: Solvents are used to dissolve the chemical reagents and provide a medium for the abrasive particles to disperse evenly in the slurry. The choice of solvent depends on the chemical nature of the reagents and the desired viscosity of the slurry. Some of the commonly used solvents include water, ethylene glycol, and isopropyl alcohol. Stabilizers: Stabilizers are added to the CMP Slurry to prevent the aggregation of the abrasive particles and maintain the stability of the slurry over time.
Common stabilizers include polyethylene glycol (PEG) and polyvinyl alcohol (PVA). pH and Viscosity: The pH and viscosity of the CMP Slurry are critical parameters that affect the polishing rate and selectivity. The pH of the slurry must be carefully controlled to ensure that the chemical reactions between the reagents and the wafer surface occur at the optimal rate. The viscosity of the slurry affects the flow rate and the contact time between the abrasive particles and the wafer surface.
Read More @ https://cmibloginsight.blogspot.com/2023/04/the-science-of-cmp-slurry-exploring-key.html
English
Arabic
Français
Português
Deutsch
Türkçe
Dutch
Italiano
Russian
Romaian