The copper clad laminates market is expected to witness market growth at a rate of 7.4% in the forecast period of 2022 to 2029 and is expected to reach USD 9,696.35 million by 2029. Data Bridge Market Research report on copper clad laminates market provides analysis and insights regarding the various factors expected to be prevalent throughout the forecast period while providing their impacts on the market’s growth. The rise in the electronic packaging technology is escalating the growth of copper clad laminates market.
Copper clad lamination provides excellent insulation, conductivity, signal and support transmission which makes it a fundamental raw material for PCB fabrication.
Major factors that are expected to boost the growth of the copper clad laminates market in the forecast period are the rise in the demand for PCBs in various end-use industries and the growing need for 5G infrastructure materials. Furthermore, the sturdy need for the copper clad laminates market is mainly its use in the hardware industry is further anticipated to propel the growth of the copper clad laminates market.
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Some of the major players operating in the copper clad laminates market are Comet Impreglam LLP., Sumitomo Bakelite Co., Ltd., Chang Chun Group., Shanghai Nanya, Shandong Jinbao Electronics Co., LTD., Taiwan Union Technology Corporation., Doosan Corporation., GRACE ELECTRON, NAN YA PLASTICS CORPORATION, Isola Group, Panasonic Corporation, ITEQ CORPORATION, SHENGYI TECHNOLOGY CO., LTD., and Cipel Italia S.r.l., among others.
Scope of the Copper Clad Laminates Market Report:
The copper clad laminates market is segmented on the basis of product, reinforcement material, resin and application. The growth amongst the different segments helps you in attaining the knowledge related to the different growth factors expected to be prevalent throughout the market and formulate different strategies to help identify core application areas and the difference in your target markets.
- On the basis of product, the copper clad laminates market is segmented into Rigid Copper Clad Laminates and Flexible Copper Clad Laminates. Rigid copper clad laminates are further sub segmented into Rigid copper clad laminates is further sub segmented into metal substrate, build-up multilayer substrate, thermoplastic substrate, ceramic substrate, capacitor embedded substrate and others.
- On the basis of reinforcement material, the copper clad laminates market is segmented into glass fiber, paper base and compound materials.
- On the basis of resin, the copper clad laminates market is segmented into epoxy, phenolic, polyimide, polyester (PET), fluoropolymer/PTFE, polyphenylene ether (PPE), polyphenylene oxide (PPO), and others.
- On the basis of application, the copper clad laminates market is segmented into computers, communication system, consumer appliances, vehicle electronics, healthcare devices, defense technology and other applications. Other applications are further sub segmented into aerospace and space explorations.
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Copper Clad Laminates Market Regional Analysis/Insights
The Copper Clad Laminates market is analyzed and market size insights and trends are provided by country, material type, end user and application as referenced above.
The countries covered in the Copper Clad Laminates market report are U.S., Canada and Mexico in North America, Germany, France, U.K., Netherlands, Switzerland, Belgium, Russia, Italy, Spain, Turkey, Rest of Europe in Europe, China, Japan, India, South Korea, Singapore, Malaysia, Australia, Thailand, Indonesia, Philippines, Rest of Asia-Pacific (APAC) in the Asia-Pacific (APAC), Saudi Arabia, U.A.E, Israel, Egypt, South Africa, Rest of Middle East and Africa (MEA) as a part of Middle East and Africa (MEA), Brazil, Argentina and Rest of South America as part of South America.
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