The Electrically Conductive Adhesives Market Is Estimated To Witness High Growth
SWOT Analysis
Strength: Electrically Conductive Adhesives provides better thermal conductivity than solder joints and eliminate the need for socketed connections. They offer greater design flexibility to interconnect components in difficult assembly environments. Adhesives bond all types of surfaces like metal, plastic and ceramic with minimal surface preparation.
Weakness: Electrically Conductive Adhesives require extended cure times compared to soldering. Changes to circuit designs after application can be difficult due to the permanence of the adhesive bond.
Opportunity: Growth of consumer electronics industry drives the demand for Electrically Conductive Adhesives in device assembly. Increasing prevalence of connected & autonomous vehicles also provides opportunities for ECA manufacturers.
Threats: availability of alternative interconnect technologies like soldering and deposition techniques pose challenges. Volatility in prices of silver, a key raw material can threaten profitability.
Key Takeaways
The Global Electrically Conductive Adhesives Market Growth is expected to witness high, exhibiting CAGR of 5.6% over the forecast period, due to increasing miniaturization of devices. Rapid proliferation of IoT devices and proliferation of 5G networks will further fuel the market growth over the coming years.
Regional analysis Asia Pacific is expected to dominate the global Electrically Conductive Adhesives market over the forecast period. Countries like China, Japan, South Korea and Taiwan are major markets for consumer electronics and automotive industries which drives the demand for ECA in the region. North America and Europe are also significant markets owing to presence of key electronic manufacturing industries.
Key players operating in the Electrically Conductive Adhesives are 3M, Aremco, Creative Materials Inc., Dow, H.B. Fuller Company, Henkel AG & Co. KGaA, HITEK Electronic Materials Ltd, Master Bond Inc., MG Chemicals, Panacol-Elosol GmbH, Parker Hannifin Corp., and Permabond LLC.
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