Flexible Hybrid Electronics: The Future of Wearable Technology |...

Flexible Hybrid Electronics: The Future of Wearable Technology

Veröffentlicht 2024-03-26 13:07:03

Introduction to Flexible Hybrid Electronics
Flexible hybrid electronics (FHE) integrates electronic and photonic components on thin, lightweight, and durable plastic or rubber substrates to create devices that are conformal and shape-deforming. By combining the mechanical flexibility of traditional electronics using materials like plastics with the performance of more rigid chips and components, FHE allows for wearable devices and smart skins that can flex and stretch with the human body.

History and Development of FHE Technology
Research into flexible and stretchable electronics began in the late 1990s but gained significant momentum in the 2010s as interest grew around applications for wearables and implantables. Early demonstrations integrated silicon chips onto thin plastic foils while more recent advancements have focused on developing all the core electronics like transistors, diodes, and sensors entirely from soft and stretchable materials. The commercialization of FHE is also accelerating with companies developing prototypes for smart apparel, healthcare patches, and human-machine interfaces. Continued advances in materials science will further enhance the functionality, integration density, and lifetime of flexible hybrid technologies.

Materials and Fabrication Techniques
Key to developing highly Flexible Hybrid Electronics is the choice of substrate materials. Plastics like polyethylene terephthalate (PET) and polyimide offer mechanical flexibility and stability at elevated processing temperatures. Liquid crystal polymers allow embedding of components during curing. Elastomers made of silicone rubber provide the highest degree of stretchability. Multimaterial 3D printing, transfer printing, and extrusion processes enable precise integration and packaging of rigid components with stretchable interconnects and encapsulants. Emerging techniques also utilize semi-liquid metals and biomimetic architectures for self-healing and self-assembling circuits. Ongoing research optimizes material properties like modulus, conductivity, and degradation resistance.

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