The US market for radiation-hardened electronics is growing, thanks to the presence of key manufacturers in the country. The increase in space programs by various agencies in the US is expected to further drive the market for radiation-hardened components, especially for planetary exploration purposes. For instance, NASA launched its super heavy-lift launch vehicle called the Space Launch System (SLS) in November 2022. The SLS is a launch platform for sending humans to the moon and deeper into the solar system, using the Orion Spacecraft and the ground operation and launch facilities of the Kennedy Space Center in Florida. Increased demands on satellite TV, weather monitoring, R&D, and commercial navigation have also played a role in the growth of the radiation-hardened electronics industry.

The radiation hardened electronics industry size is expected to grow from USD 1.7 billion in 2024 to USD 2.1 billion by 2029.; it is expected to grow at a CAGR of 4.8% from 2024 to 2029. The use of radiation-hardened electronics industry in military missions is undergoing significant growth; for instance, modern military platforms like fighter jets, tanks, and drones integrate numerous electronic systems. Radiation hardening ensures the reliable operation of these systems within the complex electromagnetic environment of modern warfare.

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Federal and State-Level Incentives

Satellite designers and the US government have been developing new methods to increase component reliability, as these components need to withstand the harsh space environment. The demand for military satellites for intelligence, surveillance, and reconnaissance (ISR) and communication bandwidth has led designers to increase the capabilities of smaller form factors. NASA has also been utilizing its budget to explore the outer reaches of space further through planetary missions, along with budget funding to commercial space agencies. The US government and key players in the market have been undertaking several research & development activities in space exploration, which has further fueled the market's growth. For instance, SpaceX, one of the private players in the US, has been working on developing partially reusable launch vehicles that aim to take humans on deep space exploration missions. The growth of private space sector companies, such as SpaceX, Blue Origin, Planet Labs, and Spire, has also increased private funding for space-based ventures in the last decade. In February 2022, Northrop Grumman's Cygnus spacecraft launched the Antares rocket from the NASA facility. The vehicle carried supplies for crews, scientific research, and hardware to support on-orbit operations.

Challenges for the Radiation-Hardened Electronic Market in the US

Significant challenges exist for the development of radiation-hardened electronics in the US. The high cost of developing realistic testing environments that emulate the extreme radiation conditions encountered in space and nuclear environments represents one of the main challenges. Such testing facilities have complex equipment and several radiation sources, making them costly and labor-intensive to establish and maintain. The limited domestic production capacity for radiation-hardened components is considered a risk to national security; the increased reliance on foreign suppliers, in turn, can compromise critical military systems. Lastly, the pace at which technology improves in electronics surpasses the progress of developing an alternative to radiation-hardened, leading to a lag between the performance and capabilities of a standard commercial product.

Radiation Hardened Electronics Industry : Key Market Players Microchip Technology Inc. (US), BAE Systems (UK), Renesas Electronics Corporation (Japan), Infineon Technologies AG (Germany), STMicroelectronics (Switzerland), AMD (US), Texas Instruments Incorporated (US), Honeywell International Inc. (US), Teledyne Technologies Inc. (US), and TTM Technologies, Inc. (US). SMEs/startups covered in the study are Cobham Limited (UK), Analog Devices, Inc (US), Data Devices Corporation (US), 3D Plus (France), Mercury Systems, Inc. (US), PCB Piezotronics, Inc (US), Vorago (US), Micropac Industries, Inc (US), GSI technology, Inc (US), Everspin Technologies Inc (US), Semiconductor Components Industries, LLC (US), AiTech (US), Microelectronics Research Development Corporation (US), Space Micro, Inc (US), and Triad Semiconductor (US).

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