Market Overview: 3D ICs help integrate two or more layers of active electronic components to increase performance, power, and density. These ICs enable vertical integration of memory on logic chips and interconnect on the same silicon. The major application areas include smartphones, networking devices, gaming consoles, and high-performance computing. Increasing demand for advanced computing...
Arabic
Français
Español
Português
Deutsch
Türkçe
Dutch
Italiano
Russian
Romaian