The die bonder equipment market is estimated to be worth US$ 4,415.3 million in 2023 and is set to surpass US$ 6,726.7 million by 2033. The adoption of die bonder equipment is likely to rise at a CAGR of 4.3% from 2023 to 2033.
Several drivers propel the die bonder equipment industry. The burgeoning demand for advanced semiconductor devices like microchips and sensors fuels the need for...
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