Photosensitive Polyimide for Electronic Packaging Market: Expected to grow at a CAGR of 5.36% from 2024 to 2032, reaching USD 3.31 billion by 2032
  Market Overview: Photosensitive Polyimide for Electronic Packaging The global market for photosensitive polyimides (PSPI) in electronic packaging is projected to experience significant growth, driven by its critical role in semiconductor and electronics industries. With applications in chip packaging, printed circuit boards (PCBs), and display panels, PSPI offers exceptional thermal...
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