Integrated circuits known as 3D ICs have two or more circuit layers in a single container. The layers are connected both horizontally and vertically. These multi-layer chips are typically produced as distinct layers, which are then stacked and thinned. It has been popular in semiconductors to vertically stack integrated circuits (ICs) or circuitry as a practical way to satisfy the demands of electronic devices, such as improved performance, more functionality, reduced power consumption, and a smaller footprint.
Technologies for 3D integration refer to the different techniques and procedures utilised to accomplish this. When silicon wafers or dies are stacked and connected vertically, a three-dimensional integrated circuit, or 3D IC, is created. To boost performance while using less power and a smaller footprint, 3D ICs are employed as a single device. On a single chip, 3D ICs feature numerous layers of active electrical components that are integrated both horizontally and vertically.
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